ISO 9001:2000 Certified
Workmanship to IPC-A-610 - Class II & Class III
PCBA, Cable and Mechanical Assembly; Programming, Test & Debug: Box Build & Calibration
Concept, Prototype, NPI, & “On-Shore” Product Configurations
Consignment, Bulk Consignment, Partial Turn Key, and Full Turn Key Manufacturing Models
Logistics and Materials Management - Purchasing, Cost Reduction, Distribution Fulfillment
Surface Mount Assembly
Pb Free SAC 305 & SAC 405 and Pb Sn63/Pb37 in No-Clean & Water Soluble Flux Packages
Single and double sided solder paste and/or epoxy process – single or combined process
Intrusive and Standard SMT Process
Thermal curing or processing profiles
POP (Package-on-Package Process); Pre stacked POP down to .4m. - Developing Inline Process
Machine placement - Maximum Placements per hour ~ 171,000 CPH
Maximum PCB Size – 21.5” X 23.5”
Component Size - 0201 & up
BGAs to 0.4mm(16mil) pitch production ; CSPs 0.25mm(10 mils) pitch proto
Material Handling -Bulk, Strip, Reel, Stick, Trays and Gel/Waffle packs
Thru Hole Assembly, Touch Up and Second Operations
Water-Soluble and No-Clean soldering fluxes
Sn63/Pb37 Wave Soldering - Maximum PCB width ~ 15.5” SAC 305 and Sn63/Pb37 Selective and Hand Soldering
Standard and on-BGA rework
BGA Rework and Processing
Moisture Conditioning Bake and Vacuum Sealing
Sn63/Pb37 and Pb-free BGA Removal, Site Prep and/or Replacement
Sn63/Pb37 and Pb-free BGA Re-balling
Sn63/Pb37 and Pb-free BGA Repair and Package Modification (subject to requirements)
POP Removal / Replacement / Reball - Developing Process for Top Part Replacement Only
Inspection and Test
AOI and Microscope Inspection
Flying Head Probe
Test and Calibration labor for Customer Supplied Test Systems
Test Modifications and Improvements for Customer Supplied Test System
Some Tester Design and Test Methodology development
Engineering Process Support
DFM Analysis and component/assembly defect or failure RCA
Pb-Free, Sn63/Pb37 and other alloy Soldering Process Development
Assembly Process Development – Design, Mechanical Assembly and Cleaning Methods
X-Ray (Planar 5 micron resolution) for BGA Inspection & PCB/PCA Defect Analysis
Power –on, Hot-Cold Temp Cycling Environmental Chamber available
